Artifact-Free Sample Preparation of Metal Thin Films Using Xe Plasma-Focused Ion Beam Milling for Atomic Resolution and In Situ Biasing Analyses

Tuesday publication post! In this newest publication, the authors have looked at different ion beam milling techniques to make FIB lamella for electrical biasing with the #FusionAX system!

When it comes to transmission electron microscopy (TEM) sampling, traditional Ga ion beam techniques often introduce damage, lowering the chemical stability of samples, particularly for metal thin films. These authors used a Xe plasma-focused ion beam (PFIB) technology to mill heteroepitaxial Ag/Cu metal films.

✨Using Xe PFIB ensures pristine sample integrity without the physical or chemical damage associated with Ga ions. In our studies, Ag/Cu interface structures remained intact, free from elemental mixing and more stable over time—even after air exposure.

⚡Performing in situ electrical biasing with Fusion AX, the Xe-prepared Cu thin films showcased flawless structural properties, ideal for electromigration studies without unwanted artifacts.

A great paper, showing a leap forward for high-precision, artifact-free analysis in materials science!

Want to read the entire paper?
Find it here!
https://doi.org/10.1016/j.matchar.2024.114260

Want to know more about how the Fusion AX system can be used for electrical biasing techniques?
https://www.protochips.com/solutions/by-applications/electronic-devices/

#FusionAX #Protochips #FindYourBreakthrough #XePFIB #ElectronMicroscopy #MaterialsScience #TEM #InSitu #Electromigration #Nanotechnology #Innovation